From initial multi-layer PCB circuit design to high-throughput cloud webhooks, Atlanta Systems delivers turnkey electronics manufacturing, embedded firmware customization, and enterprise fleet homologation services worldwide.
State-of-the-art SMT assembly facilities in New Delhi. Custom multi-layer PCB design, automated optical inspection (AOI), X-ray BGA verification, and conformal coating for severe industrial operating environments.
Explore OEM Manufacturing →Type-approval certifications and official data push compliance for MoRTH AIS-140 (ARAI & ICAT India), UAE RTA & SIRA (Dubai), Saudi TGA WASAL (GCC), and FMCSA ELD Part 395 standards (USA).
Request Certification Package →Certified engineering technicians performing multi-point capacitive fuel tank calibration, ultrasonic sensor profiling, BLE beacon mapping, and guaranteed 24/7 hardware replacement SLAs.
Book Field Engineering Team →Custom C/C++ embedded firmware development for automotive microcontrollers. Native support for SAE J1939, J1708, OBD-II PIDs, CAN FD parsing, proprietary sensor protocol bridging, and cryptographic secure boot.
Custom Firmware Inquiries →High-throughput MQTT, TCP, and RESTful telemetry gateways capable of streaming sub-second GPS packets directly into enterprise ERP, TMS, and WMS platforms (SAP, Oracle, Navixy, Wialon, and Traccar).
View API Documentation →Private-label manufacturing for regional telematics providers. Custom enclosure injection molding, branded silk-screen labeling, bespoke harness looms, and customized packaging for turnkey distributor distribution.
Partner With Us →Operating ISO 9001:2015 certified surface-mount assembly lines, Atlanta Systems ensures zero-defect production across every commercial telematics terminal.
Multi-layer PCB layout with dedicated impedance matching, ground planes, and ISO 7637-2 surge protection.
Precision robotic pick-and-place component mounting down to 0201 packages with lead-free reflow profiling.
100% AOI optical solder inspection and X-ray BGA void analysis guaranteeing long-term road vibration resilience.
48-hour thermal environmental chamber cycling from -20°C to +75°C prior to final quality serialization.
Speak directly with our hardware engineering and firmware development teams in New Delhi to discuss your project requirements.
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